ISO14644-1:1999 Cleanrooms and associated controlled environments

Cleanroom
For the Cleanroom software engineering methodology, see Cleanroom Software Engineering.
For the meaning of Cleanroom engineering as a method to avoid copyright infringement, see Clean room design.

NASA's Glenn Research Center cleanroom, used for the production of microsystems. The yellow lighting is necessary for photolithography, so as to prevent unwanted exposure of photoresist to light of shorter wavelengths.

Clean room from outside (Cardiff University)

Entrance to a clean room with no air shower (Cardiff University)

Cleanroom for Microelectronics Manufacturing

Cleanroom cabin for precision measuring tools
A cleanroom is an environment, typically used in manufacturing or scientific research, that has a low level of environmental pollutants such as dust, airborne microbes, aerosol particles and chemical vapors. More accurately, a cleanroom has a controlled level of contamination that is specified by the number of particles per cubic meter at a specified particle size. To give perspective, the ambient air outside in a typical urban environment contains 35,000,000 particles per cubic meter, 0.5 μm and larger in diameter, corresponding to an ISO 9 cleanroom.

Contents[hide]
1 Overview
2 Cleanroom air flow principles
3 Cleanroom classifications
3.1 US FED STD 209E Cleanroom Standards
3.2 ISO 14644-1 cleanroom standards
3.3 BS 5295 cleanroom standards
4 See also
5 References
6 External links




ISO 14644-1:1999
Cleanrooms and associated controlled environments -- Part 1: Classification of air cleanliness
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General information
Number of Pages: 18
Edition: 1 (Monolingual)
ICS: 13.040.35
Status: Published
Stage: 90.92 (2008-12-05)
TC/SC: TC 209

Revision information
Revised by: ISO/CD 14644-1
Corrigenda, Amendments and other parts
ISO 14644-2:2000
ISO 14644-3:2005
ISO 14644-4:2001
ISO 14644-5:2004
ISO 14644-6:2007
ISO 14644-7:2004
ISO 14644-8:2006



STI Electronics becomes ISO14644-1:1999 certified

Jan 12, 2010
STI Electronics, Inc., a full service organization providing training, electronic and industrial distribution, consulting, laboratory analysis, prototyping, and small- to medium-volume PCB assembly, announces that it has received certification in accordance with Nebb Procedural Standards per the requirements of ISO14644-1:1999 for ISO Class 6 (Class 1000) Manufacturing Cleanroom for Electronic Hardware.

STI's 2,000 sq ft cleanroom facility has been added to produce military and medical devices that require cleanroom manufacturing standards and practices. This is another milestone and building block for STI's growth to become a full-service provider of microelectronic assemblies and sensors as well as high-end standard and hybrid electronic assemblies for its customer base.

David Raby, President & CEO, said, "I am excited about our future and our commitment to excellence in electronics. This is another example of our commitment to our new and existing customers by investing in facilities and capital equipment needed to keep STI on the cutting edge of electronics manufacturing."

This allows STI to expand its manufacturing capabilities and expertise, and gives its customers greater design solutions to meet future electronic system objectives. The room is certified to ISO Class 6 (Class 1000) air cleanliness standards but was built to maintain and operate at ISO Class 5 (Class 100) standards. With onsite high-accuracy temperature, humidity, and particle-counter monitors, STI is able to provide daily monitoring to ensure continuous compliance with the ISO14644-1:1999 cleanroom standards.

Mark McMeen, Vice President, stated, "This is our second cleanroom design. We are very proud of this addition and the further capabilities that we can now offer our customers by operating at a higher standard than is required for high-end microelectronic assemblies".

STI Electronics is an ISO CERTIFIED 9001:2008 electronics manufacturing facility specializing in high-end circuit card assemblies and microelectronic/sensor modules. STI has a patented Imbedded Component/Die Technology called IC/DT that also will benefit from the increase in cleanroom size. STI's IC/DT packaging technology is a more reliable alternative to SMT to meet size, weight, and power (SWAP) requirements for critical, high-rel applications. IC/DT integrates thermal management and imbeds unpackaged components and bare die in a 3-D laminate substrate, which reduces heat, increases reliability and meets small form-factor requirements.

For more information about STI Electronics Inc., visit http://www.stielectronicsinc.com/ .